Wafer Bonding Services
Desert Silicon is now offering wafer bonding services in our class 100 wafer bonding clean room.
Desert Silicon is now offering wafer bonding services in our class 100 wafer bonding clean room.
1 inch to 6 inch wafers can be bonded together utilizing BCB adhesive bonding.
Nicely established process for adhesive wafer bonding utilizing BCB (benzocyclobutene).
We can do wafers up to 6 inch in diameter at vacuum levels of 5 X 10-3 (utilizing roughing and turbo pumps).
Upper and lower electrode temperature ramping capability up to 450C.
A large variety of substrates can be accommodated.
See data sheet, or call or email for details.
